Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908758 | Semiconductor package including dual stiffener | Heungkyu Kwon, Heeseok Lee | 2024-02-20 |
| 11908810 | Hybrid semiconductor device and electronic device | Heungkyu Kwon, Heeseok Lee | 2024-02-20 |