Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183653 | Thermal conductive film | Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2024-12-31 |
| 12062633 | Non-conductive film sheet and semiconductor package including the same | Yeongseok Kim | 2024-08-13 |
| 11876031 | Thermal interface material paste and semiconductor package | Wonkeun Kim, Mihyae PARK | 2024-01-16 |