Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062493 | Multilayer electronic component | Ho In Jun, Kyeong Jun Kim, Woo Chul Shin, Seul Gi Kim | 2024-08-13 |
| 11875998 | Substrate processing method | Kwang Seon JIN, Sang Jun Park, Byung Chul Cho, Jun Hyuck Kwon | 2024-01-16 |