Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014878 | Conductive paste including metal portions having different melting points and multilayer ceramic component using the same | Chung Hyeon Ryu, Jun Ho Yun, Ye Ji Hwang, Seung Been Kim | 2024-06-18 |