Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876017 | Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same | Tae Yong Bae, Ki Hyun PARK, Hak-Sun Lee | 2024-01-16 |
HS
Hoon Seok Seo
Overall (2024): #441,266 of 561,600Top 80%
1
Patents 2024