Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176308 | Package substrate and semiconductor package including the same | Youngkyu Lim, Sunguk LEE | 2024-12-24 |
| 11894333 | Semiconductor package | Dahee KIM, Jeongrim Seo | 2024-02-06 |