Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009152 | Multilayer capacitor | Hong Gi Nam, Seung In Baik, Ji Su Hong, Hee Sun Chun, Jae Sung Park | 2024-06-11 |
| 11923145 | Multilayer capacitor having improved reliability by adjusting grain size of dielectric layer | Je Hee LEE, Seung In Baik, Ji Su Hong, Hyoung Uk Kim, Jae Sung Park | 2024-03-05 |
| 11915880 | Multilayer electronic component including side margin portion having composition gradient across thickness thereof | Hee Sun Chun, Hyoung Uk Kim, Jae Sung Park, Hyeg Soon AN, Ku-Tak Lee | 2024-02-27 |