Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176328 | Semiconductor package and stacked package module including the same | Kilsoo Kim | 2024-12-24 |
| 12133404 | Organic light-emitting diode and method of manufacturing the same | Yeongrong Park, Dongkyu Seo, Junyong Shin, Byeongwook Yoo, Byungseok Lee | 2024-10-29 |
| 12062647 | Semiconductor package | Jinhyun Kim, Wansoo Park | 2024-08-13 |
| 11923351 | Stacked-chip packages having through vias | Taeje Cho | 2024-03-05 |