Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021055 | Semiconductor package and method for manufacturing semiconductor package | — | 2024-06-25 |
| 11923286 | Package substrate and semiconductor package including the same | Wonjung Jang | 2024-03-05 |