Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033991 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2024-07-09 |
BC
Byeong-Yeon Cho
Overall (2024): #520,484 of 561,600Top 95%
1
Patents 2024