Bongken Yu

Samsung: 2 patents #4,211 of 17,120Top 25%

Overall (2024): #181,643 of 561,600Top 35%

Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
11996387	Semiconductor package	—	2024-05-28
11961795	Semiconductor package and package-on-package including the same	—	2024-04-16