Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935812 | Thermal interface material and semiconductor packages including the same | Seunggeol Ryu, Seokkan Ki, Youngsuk Nam, Jaechoon Kim, Seungtae Hwang | 2024-03-19 |
BL
Bangweon Lee
University-Industry Cooperation Group Of Kyung Hee University: 1 patents #35 of 124Top 30%
Overall (2024): #531,879 of 561,600Top 95%
1
Patents 2024