Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12022604 | Power substrate and high-voltage module equipped with same | Kei Nishioka, Takashi Nakamura, Tsuyoshi FUNAKI | 2024-06-25 |
| 11973007 | Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold | — | 2024-04-30 |
| 11967543 | Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold | — | 2024-04-23 |