Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091312 | Sensor and package assembly thereof | Ken Chang | 2024-09-17 |
| 12030139 | Sn—Cu mixed alloy solder paste, method of making the same and soldering method | Eckart Schellkes, Yee-Wen Yen, Chia-Yu Liu | 2024-07-09 |