Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109614 | Layer forming apparatus, method of forming powder layer, and recording medium | Tomoki KAI, Yasutomo Aman | 2024-10-08 |
| 11926931 | Resin powder for solid freeform fabrication, device for solid freeform fabrication object, and method of manufacturing solid freeform fabrication object | Akira Saito, Shigenori Yaguchi, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto +3 more | 2024-03-12 |