Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071339 | Micro-acoustic wafer-level package and method of manufacture | Manuel Hofer, Stefan Leopold Hatzl, Josef EHGARTNER, Peter Bainschab | 2024-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071339 | Micro-acoustic wafer-level package and method of manufacture | Manuel Hofer, Stefan Leopold Hatzl, Josef EHGARTNER, Peter Bainschab | 2024-08-27 |