KK

Keitaro KAWAKITA

RP Resonac Packaging: 1 patents #2 of 4Top 50%
📍 Hikone, JP: #4 of 14 inventorsTop 30%
Overall (2024): #387,223 of 561,600Top 70%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12065591 Packaging material for molding Yuji MINAMIBORI 2024-08-20