Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935803 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi | 2024-03-19 |
| 11924979 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi | 2024-03-05 |