Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089346 | Die package structure and method for fabricating the same | Hai Tao Li | 2024-09-10 |
| 11870774 | Method and system for authentication data transmission | Yang Li, Dong-Yu He, Jiayuan Tan | 2024-01-09 |