Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166010 | Semiconductor package and method of manufacturing the same | Eunseok Song | 2024-12-10 |
| 12142544 | Semiconductor package | Taehwan Kim, Young-Deuk Kim, Jae Choon Kim, Eungchang Lee | 2024-11-12 |
| 12142348 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2024-11-12 |
| 12125766 | Thermoelectric cooling packages | Tae Hwan Kim, Jae Choon Kim | 2024-10-22 |
| 12040304 | Semiconductor package and method of fabricating the same | Eunseok Song | 2024-07-16 |
| 12002540 | On-die termination of address and command signals | Ian Shaeffer | 2024-06-04 |
| 11887965 | Semiconductor package | Eunseok Song | 2024-01-30 |
| 11882647 | Structure for delivering power | Ralf M. Schmitt, Yijiong Feng | 2024-01-23 |
| 11862618 | Semiconductor package | Manho Lee, Eunseok Song, Keung Beum Kim, Eon Soo Jang | 2024-01-02 |