Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125742 | Package comprising a substrate with high density interconnects | Hyunchul CHO, Kun Fang, Jaehyun Yeon | 2024-10-22 |
| 12126071 | Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods | Jaehyun Yeon, Kun Fang, Hyunchul CHO | 2024-10-22 |
| 11869833 | Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same | Kun Fang, Jaehyun Yeon, Hyunchul CHO | 2024-01-09 |