Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027476 | Package comprising substrate with coupling element for integrated devices | Fnu Suraj Prakash, Paragkumar Ajaybhai Thadesar, John Jong-Suk Lee, Peng Song, Francesco Carrara | 2024-07-02 |