Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996384 | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications | Vahid Akhavan Attar | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996384 | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications | Vahid Akhavan Attar | 2024-05-28 |