Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154863 | Fan-out semiconductor package and method for manufacturing the same | Nan-Chun Lin, Hung-Hsin Hsu | 2024-11-26 |
| 11990494 | Package structure and manufacturing method thereof | Hung-Hsin Hsu | 2024-05-21 |
| 11973037 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2024-04-30 |
| 11916035 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2024-02-27 |