Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180381 | Conductive liquid metal microparticles comprising hydrogen-doped liquid metal oxide, conductive ink comprising same, and preparation method therefor | Unyong Jeong | 2024-12-31 |
| 11974393 | Flexible electrode circuit capable of being 3D circuit printed strain sensor using same, and manufacturing method therefor | Unyong Jeong | 2024-04-30 |