Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11904626 | Integrated envelope sealer and flip module | John R. Masotta, Boris Rozenfeld, Daniel Wright, Anthony E. Yap | 2024-02-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11904626 | Integrated envelope sealer and flip module | John R. Masotta, Boris Rozenfeld, Daniel Wright, Anthony E. Yap | 2024-02-20 |