Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109779 | Copper-clad laminate, wiring board, and copper foil with resin | Yuki Inoue, Yuki Kitai | 2024-10-08 |
| 11895770 | Copper-clad laminate, wiring board, and copper foil provided with resin | Yuki Inoue, Shun YAMAGUCHI | 2024-02-06 |