Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063747 | Surface-treated copper foil, copper-clad laminate and printed wiring board using the surface-treated copper foil | Takeshi Okamoto | 2024-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063747 | Surface-treated copper foil, copper-clad laminate and printed wiring board using the surface-treated copper foil | Takeshi Okamoto | 2024-08-13 |