Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084243 | Packaging with paper material | Reinhard Ruhland, Marius Schulte, Claus Jurisch, Christian KIND, Dominik HOFERER +1 more | 2024-09-10 |
| 12057311 | Method for manufacturing a semiconductor device using a patterned dielectric mask and semiconductor device | Adrian Stefan Avramescu | 2024-08-06 |
| 11961820 | Method for producing a connection between component parts, and component made of component parts | Simeon Katz, Mathias Wendt, Sophia Huppmann, Marcus Zenger | 2024-04-16 |