Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872651 | Dissimilar material solid phase bonding method, dissimilar material solid phase bonded structure, and dissimilar material solid phase bonding device | Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki | 2024-01-16 |