Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967522 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu | 2024-04-23 |
CW
Chia-Yu Wu
Overall (2024): #504,485 of 561,600Top 90%
1
Patents 2024