HM

Hirohisa Masuda

TC Toyo Seikan Co.: 1 patents #24 of 87Top 30%
Overall (2024): #444,507 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12144239 Substrate for flexible device Kouji Nanbu, Toshihiko Miyazaki, Hiroshi Shimomura 2024-11-12