PL

Pat Lee

NU Nxp Usa: 1 patents #84 of 302Top 30%
📍 Kaohsiung, CA: #16 of 28 inventorsTop 60%
Overall (2024): #317,446 of 561,600Top 60%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12068228 Leadless semiconductor package with shielded die-to-pad contacts — 2024-08-20