HI

Hamdan Ismail

NU Nxp Usa: 1 patents #84 of 302Top 30%
📍 Seremban, MY: #6 of 11 inventorsTop 55%
Overall (2024): #451,417 of 561,600Top 85%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12087671 Overmolded microelectronic packages containing knurled flanges and methods for the production thereof Audel A. Sanchez, Jerry L. White, Frank E. Danaher, David J. Dougherty, Aruna Manoharan 2024-09-10