ML

Mei Yeut Lim

NB Nxp B.V.: 2 patents #48 of 297Top 20%
Overall (2024): #136,437 of 561,600Top 25%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12125780 Extendable inner lead for leaded package 2024-10-22
11869837 Semiconductor device packaging extendable lead and method therefor 2024-01-09