Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125771 | Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof | Chanon Suwankasab, Amornthep Saiyajitara, Verapath Vareesantichai | 2024-10-22 |