Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973060 | Extended through wafer vias for power delivery in face-to-face dies | Joseph Minacapelli | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973060 | Extended through wafer vias for power delivery in face-to-face dies | Joseph Minacapelli | 2024-04-30 |