Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12158362 | Sensor package and method for attaching sensor package | Akiko Tanaka, Yoshiko KIRA, Shintaro Fukumoto, Shun Imagawa, Takayuki NISHIDO | 2024-12-03 |
| 11951729 | Laminated sheet | Kayo Shimokawa, Tetsuya Otsuka, Hidetoshi Maikawa | 2024-04-09 |