Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12152113 | Filler-loaded high thermal conductive dispersion liquid composition having excellent segregation stability, method for producing said dispersion liquid composition, filler-loaded high thermal conductive material using said dispersion liquid composition, method for producing said material, and molded article obtained using said material | Noriaki Takagi, Masakuni Takagi, Yuusuke Nagatani, Yuuta Terao, Daisuke Watanabe | 2024-11-26 |