Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157189 | Junction structure, method for manufacturing junction structure, and solder ball | Masamoto Tanaka, Kiyotsugu Komori, Katsuhiko Hoshino, Tsunekazu Yamazaki, Takayuki Kobayashi +2 more | 2024-12-03 |