Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172242 | Lead-free solder alloy | Takatoshi Nishimura, Tetsuya Akaiwa | 2024-12-24 |
| 11980974 | Solder joint part and method for manufacturing the same | Kazuhiro Nogita, Stuart David McDonald, Shiqian Liu, Takatoshi Nishimura, Tetsuya Akaiwa | 2024-05-14 |