Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100928 | Semiconductor device, semiconductor device package, and manufacturing methods thereof | Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Sumio Uehara, Suguru Kobayashi +1 more | 2024-09-24 |