Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142892 | Semiconductor laser device | — | 2024-11-12 |
| 12048964 | Bonding material and bonding method using same | Keiichi Endoh, Minami Kanasugi, Satoru Kurita | 2024-07-30 |
HF
Hideyuki Fujimoto
Dowa Electronics Materials Co.: 1 patents #6 of 36Top 20%
Overall (2024): #161,961 of 561,600Top 30%
2
Patents 2024