Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101079 | Method of producing a bonded body of piezoelectric material substrate | Yuji Hori | 2024-09-24 |
| 11936363 | Bonded body | Saki Nakayama | 2024-03-19 |
| 11871671 | Assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing same | Yuji Hori, Tatsuro Takagaki | 2024-01-09 |