Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183704 | Semiconductor package and method for manufacturing the same | Byung Cheol Kim, Yong Tae Kwon, Dong Hoon OH, Jae Cheon Lee, Hyung Jin Shin +1 more | 2024-12-31 |
| 12125775 | Semiconductor package and method for manufacturing the same | Byung Cheol Kim, Yong Tae Kwon, Dong Hoon OH, Jae Cheon Lee, Hyung Jin Shin +1 more | 2024-10-22 |