TI

Toshiaki Inoue

FU Fujikura: 1 patents #25 of 106Top 25%
Overall (2024): #238,246 of 561,600Top 45%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11864316 Wiring substrate Naoki Oyaizu, Yusuke Fujita, Shinya Kashima 2024-01-02