Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083740 | Flexible 3D freeform techniques | Cheng-Chi Chen | 2024-09-10 |
| 12057274 | Packaging structures for electronic elements and solid electrolytic capacitor elements and methods thereof | Yu-Peng Chung, Chia-Wei Li | 2024-08-06 |
| 12057275 | Packaging of roll-type solid electrolytic capacitor elements | Yu-Peng Chung, Chia-Wei Li, Wen-Cheng Hsu, En-Ming Chen | 2024-08-06 |