Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142596 | Semiconductor structure and manufacturing method thereof | — | 2024-11-12 |
| 12100634 | Semiconductor device with re-fill layer | — | 2024-09-24 |
| 11935816 | Conductive feature with non-uniform critical dimension and method of manufacturing the same | Jheng-Ting Jhong | 2024-03-19 |
| 11935831 | Semiconductor device with connecting structure and method for fabricating the same | — | 2024-03-19 |
| 11901334 | Microelectronic devices including embedded bridge interconnect structures | — | 2024-02-13 |
| 11901344 | Manufacturing method of semiconductor package | — | 2024-02-13 |
| 11876063 | Semiconductor package structure and method for preparing the same | — | 2024-01-16 |
| 11876079 | Method for fabricating semiconductor device with recessed pad layer | — | 2024-01-16 |