Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12073994 | Electronic component including solder layer with solder unfilled region | Shinobu Chikuma, Yohei Mukobata | 2024-08-27 |
| 12020865 | Electronic component including interposer board with CU fired layer | Shinobu Chikuma, Yohei Mukobata | 2024-06-25 |
| 12009155 | Multilayer ceramic capacitor | Shinobu Chikuma, Yohei Mukobata | 2024-06-11 |
| 12009156 | Method of manufacturing multilayer ceramic capacitor | Shinobu Chikuma, Yohei Mukobata | 2024-06-11 |
| 11997791 | Electronic component | Shinobu Chikuma, Yohei Mukobata | 2024-05-28 |
| 11942273 | Electronic component | Shinobu Chikuma, Yohei Mukobata | 2024-03-26 |
| 11929208 | Multilayer ceramic capacitor | Toshihiro Harada | 2024-03-12 |
| 11923141 | Electronic component | Shinobu Chikuma, Yohei Mukobata | 2024-03-05 |
| 11901126 | Multilayer ceramic capacitor | — | 2024-02-13 |
| 11881353 | Electronic component | Shinobu Chikuma, Yohei Mukobata | 2024-01-23 |