Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119531 | Signal transmission line comprising stacked insulating layers having a signal line and a ground conductor respectively spaced apart by a spacer with a hollow portion | — | 2024-10-15 |
| 12112867 | Multilayered substrate | Nobuyuki TENNO, Takahiro Baba | 2024-10-08 |
| 12052818 | Resin multilayer substrate | Atsushi Kasuya, Tomohiko Naruoka, Noriaki Okuda, Kosuke Nishio | 2024-07-30 |
| 12004290 | Multilayer board | Nobuyuki TENNO, Takahiro Baba | 2024-06-04 |
| 11956903 | Transmission line, method of manufacturing transmission line, and electronic apparatus | — | 2024-04-09 |